Objectives
• Define yield and explain its importance
• Describe the basic structure of a cleanroom.
• Explain the importance of cleanroom protocols
• List four basic operations of IC processing
• Name at least six process bays in an IC fab
• Explain the purposes of chip packaging
• Describe the standard wire bonding and flip-chip
bump bonding processes
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发表于 2011-4-11 12:52:24
